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Aicha Elshabini still considers academics to be her greatest achievement. While no one argues with that, the dean of the University of Idaho's College of Engineering will add another industry honor to her portfolio: on Tuesday, Nov. 13, she will receive her third national award from the International Microelectronics and Packaging Society (IMAPS).

"Aicha is more than just a success story; she's an outstanding example and mentor for young women who want to pursue careers in math and science," said Ann Bell of IMAPS. "She's done so much for the society over the years and we're all so proud of her." Next week, Elshabini will earn the society's Outstanding Educator award.

Elshabini is the first woman to earn three top awards from IMAPS in its 40-year history. Last year, she was awarded the Daniel C. Hughes award for lifetime achievement in microelectronic packaging. Previously, she received the Fellow of the Society award. She also was the first woman to receive each of those honors. The Outstanding Educator award is given to an individual with significant contributions to education for the microelectronics and electronic packaging industry, and to the advancement of IMAPS student chapters.

"To have someone so well respected in their field as both an educator and a researcher serving in a leadership role at the University of Idaho is a true testament to the quality of education at our institution," said university President Tim White. "We are all so proud of Aicha and of all her past, present and future successes."

During Elshabini's 33-year career, she embarked on groundbreaking research, had overwhelming success in academics, and accumulated a list of awards and accolades that continues for pages. At Idaho, she not only leads the College of Engineering, but is a leader in her field. She has conducted research with Motorola, Northrop Grumman, Hewlett-Packard, Texas Instruments, Intel, Xerox, NASA and various military groups.

She was awarded the 1996 John A. Wagnon Technical Achievements Award in recognition of "significant contributions to the microelectronics industry in the fields of microwave hybrids and thin-film technology; and for commitment to the dissemination of knowledge as a professor, and as editor of the IMAPS International Journal of microcircuits and electronic packaging."

Despite this research and her more than $15 million in funding, 125 published scholarly articles, 150 conference participations and three text books, Elshabini still considers academics her greatest achievement.

"It is an incredible honor to be recognized by peers I've worked with for decades," she said. "My heart and true honor, however, is seeing students I've worked with and mentored to be out and successful in their selected fields."

Elshabini joined the University of Idaho's College of Engineering as dean in 2006. Under her leadership, the college is undergoing strategic planning and development efforts incorporating high school students, student organizations and each of the college's eight engineering programs around the state.

Prior to her arrival at Idaho, Elshabini served for 20 years as a professor and chair for the Electronics and Networks committee at Virginia Polytechnic Institute and State University (Virginia Tech) and seven years as the department head in the electrical engineering department at the University of Arkansas. Previously, she was recognized as a Fellow member of the Institute of Electronic and Electric Engineers (IEEE) for her contributions to hybrid microelectronic education and hybrid electronics for microwave applications. Fewer than one-tenth of one percent of IEEE's more than 300,000 members earn this honor.

Elshabini earned a bachelor's degree in electronics and communications from Cairo University in Egypt; a master's degree in microelectronics from the University of Toledo in Ohio; and a doctorate in electrical engineering and solid state devices from the University of Colorado at Boulder.