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The University of Idaho College of Engineering is now accepting applications for travel stipends to encourage high school students to attend the 2009 Engineering Design EXPO, May 1-2, 2009.

Thanks to a generous support of the Micron Foundation, hundreds of high school students from the northwest will be able to benefit from this exciting opportunity. Participating students will enjoy hands-on engineering activities and exciting robotics competitions. The goal of this program is to increase attendance of future engineers at the Engineering Design EXPO by providing travel funds for those in financial need.

Selection criteria will be based first on the number of students the proposal benefits, second on the responses to application questionnaire, and finally on the distance to travel to the University. Remember, the deadline for the Micron Travel Stipend Applications is March 13.

Primary Contact

E-mail Address

Summary of Proposal (2-3 sentences)

Why is exposure to engineering important for pre-college students?

Briefly state below how you [and/or your students]
expect to benefit by attending this event.

[For teachers only] How do you incorporate engineering in the classroom?

Please list clearly the activities you hope to carry out during your visit.

How will your travel stipend be used (means of transportation,
accommodations, etc)?

Distance to travel (in miles):

Number of students you are bringing to EXPO:

Total Dollar Amount requested:

Please provide an itemized budget: